Engineering Services
A2Z EMS provides cutting-edge engineering services for custom Printed Circuit Board manufacturing. We offer customized solutions that satisfy particular demands on performance and features. We can provide complete design and layout services that maximize circuit functionality and manufacturability. By prioritizing quality and efficiency, we guarantee the smooth integration of components, strict testing, and compliance with industry standards, producing dependable and inventive printed circuit boards (PCBs) for various applications.
Our area of expertise at A2Z EMS offers the latest engineering services for custom PCB design. Our all-inclusive solutions include thorough design and layout services that maximize circuit functionality and manufacturability through innovative software and techniques. With a dedication to efficiency and quality, we guarantee the smooth integration of components, stringent testing, and compliance with industry standards, producing dependable and creative Printed Circuit Board assembly suited to a wide range of application requirements.
650+
Unique Designs
Build In Last 12
Months
JIT
Fast track
Assembly For
JIT Designs
3
High Speed Pick &
Place Machine
Dedicated For NPI
Benefits of Our Engineering Services
Comprehensive Design Support
We provide comprehensive PCB design services using advanced tools and methodologies to create optimized PCB layouts that enhance functionality and manufacturability.
Product Performance
Our engineering services focus on increasing product performance through meticulous design. These services ensure efficient signal integrity and reliability in various operating conditions.
Faster
Time-to-Market
We accelerate time-to-market with streamlined processes and efficient project management. These processes ensure quick turnaround times without compromising quality or innovation.
Our Capabilities in Engineering Services
We leverage advanced design tools and software to develop innovative pcba's layouts that optimize performance and manufacturability, ensuring precision and efficiency in every design.
Prototyping
and
Testing
Our prototyping and testing services allow us to validate designs rigorously and refine functionality before full-scale production, minimizing risks and enhancing reliability.
Wide Range of Applications
We have expertise in various applications for wire harness assembly, from automotive and aerospace to industrial machinery and consumer electronics. At A2Z, we deliver tailored solutions to meet diverse industry needs.
Tech Sheet
Technology | Standard Technology | Advanced Technology |
|---|---|---|
Maximum Panel Size | 12"X18"Length | 22"X18"Length |
Maximum Board Thickness | 5MM | 5.8MM |
Minimum Edge of panel to Component for single side panels
(Panel mostly like be V-scored) | 0.5MM | 0.4MM |
Minimum Edge of panel to Component for Double side panels
(Panel mostly like be V-scored) | 0.75MM | 0.5MM |
Screen Printer accuracy | 0.2MM | 0.08MM |
SMT Placement accuracy | 0.05MM | 0.025MM |
Smallest component package size | 01005 Imperial (0402 Metric) | 008004 Imperial |
Reflow Profile method and equipment | KIC PROFILER | KIC PROFILER |
SPI Capability | 3D SPI Inline with SPC reporting | 3D SPI Inline with SPC reporting |
Component Lot/date code traceability process | all receiving is tracked under the ERP and saved in cloud | all receiving is tracked under the ERP and saved in cloud |
Lot Tracebility | Online portal, Muliple Manufacturing Lots with full tracebility to individual Mo thru the ERP. | Online portal, Muliple Manufacturing Lots with full tracebility to individual Mo thru the ERP. |
AOI Capability | 3D AOI with Spc Reporting | 3D AOI with Spc reporting |
BGA/PoP Capability | Min-1MM X 1MM, Max-50MM X 50MM | Min-1MM X 1MM, Max-50MM X 50MM |
Smallest BGA pitch capaibility | 0.4 MM | 0.35MM |
Smallest pitch connectors Capability | 2.54MM | 1.52MM |
Smallest Pitch QFN Capability | 0.5MM | 0.4MM |
Smallest Pitch WLCSP Capability | 0.5MM | 0.4MM |
Tallest Component Capability | 6MM | 10MM |
Largest Component Capability | 2 Inch by machine | 6 Inch by machine |
Component to Component Spacing requirement | 20 mils | 12 mils |
Shield-Shield Spacing requirement | 1.5 MM | 0.7 MM |
Stencil Type used for designs with 0201 and 0.35 pitch BGA | 3 mils nano | 3 mils nano |
Minimum Stencil Webbing for Passive/fine pitch parts | 0.3MM | 0.25MM |
Minimum Paste area and aspect ratio capability | Minimum 0.7mils area with aspect ratio 1.55 mils | Minimum 0.7mils area with aspect ratio 1.55 mils |
Minimum Panel Size | 3"X3" length | 2.5"x 3" length |