Surface Mount Technology

Our advanced facility boasts state-of-the-art fully automated Surface Mount Technology (SMT) lines equipped with an inline solder paste inspection (SPI) and a cutting-edge 10-zone reflow oven. Our precision extends to component placements, offering sizes as minuscule as 01005 packages. Diverse options abound as we specialize in placing Quad Flat Packages (QFPs), Quad Flat No-leads (QFN), micro ball grid arrays (uBGAs), Ball Grid Arrays (BGAs), and Land Grid Arrays (LGAs). Emphasizing flexibility, we provide two-sided assembly services catering to Rigid, Flex, and Rigi-Flex printed circuit boards (PCBs). Additionally, we accommodate both RoHS and Leaded assembly, ensuring our clients have a spectrum of choices aligned with their specific requirements.